Unlike bulky mechanical refrigeration systems that depend on compressors, refrigerants, and moving parts, TEC chips utilize the efektu Peltiera<\/strong> to deliver rapid, solid-state temperature control. This allows for millisecond-level response times and temperature stability as precise as \u00b10.01\u00b0C, all within a compact, silent, and vibration-free design.<\/p>\n In this article, we will explore how a TEC chip works, why it can outperform traditional cooling methods in precision applications, and how it is enabling advancements across industries ranging from optoelectronics and medical diagnostics to electric vehicle systems.<\/p>\n At the heart of every\u00a0Uk\u0142ad TEC<\/strong> lies a principle discovered by Jean\u2011Charles Peltier in 1834. When a direct current (DC) flows through a circuit made of two dissimilar conductors, one junction absorbs heat (the cooling side) while the other junction releases heat (the hot side). Modern thermoelectric modules replace simple metal wires with dozens or hundreds of semiconductor \u201ccouples\u201d \u2014 typically bismuth telluride (Bi\u2082Te\u2083) pellets \u2014 arranged electrically in series but thermally in parallel.<\/p>\n When DC voltage is applied, electrons move from the negative to the positive terminal. As they cross from a p\u2011type to an n\u2011type semiconductor pellet, they absorb lattice heat energy at the cold junction. After travelling through the circuit, they release that energy as waste heat at the hot junction. The result: one face of the\u00a0Uk\u0142ad TEC<\/strong>\u00a0becomes cold (sometimes below -50\u00b0C), while the opposite face becomes hot, ready to be dissipated by a heat sink and fan.<\/p>\n Because there are no compressors, expansion valves, or refrigerants, a\u00a0Uk\u0142ad TEC<\/strong>\u00a0is sometimes called a \u201csolid\u2011state\u201d heat pump. Its simplicity is its superpower: only electrical current controls the temperature, and reversing the current instantly swaps the hot and cold sides \u2014 enabling both heating and cooling from the same device.<\/p>\n A typical\u00a0thermoelectric cooler chip<\/strong>\u00a0consists of:<\/p>\n Semiconductor pellets<\/strong>\u00a0(p\u2011type and n\u2011type Bi\u2082Te\u2083) \u2013 typically 1.0\u202fmm \u00d7 1.0\u202fmm \u00d7 1.2\u202fmm each.<\/p>\n<\/li>\n Metal interconnects<\/strong>\u00a0\u2013 usually copper or aluminum, bonding pellets in series.<\/p>\n<\/li>\n P\u0142ytki ceramiczne<\/strong> \u2013 high\u2011purity alumina (Al\u2082O\u2083) or aluminum nitride (AlN), providing electrical insulation and structural rigidity.<\/p>\n<\/li>\n Sealing (optional)<\/strong>\u00a0\u2013 epoxy or silicone edge seal to prevent moisture ingress in high\u2011humidity environments.<\/p>\n<\/li>\n Lead wires<\/strong>\u00a0\u2013 for DC power input and optional thermistor feedback.<\/p>\n<\/li>\n<\/ul>\n Unlike compressor cycles that take seconds to minutes to alter temperature, a properly driven\u00a0Uk\u0142ad TEC<\/strong>\u00a0can achieve a notable heat\u2011pumping effect in\u00a0under 100 milliseconds<\/strong>. Because the heat transfer occurs directly at the atomic level, there is no thermal inertia from a circulating refrigerant. Under closed\u2011loop PID control, a TEC can go from +25\u00b0C to +5\u00b0C in less than 2 seconds (for a small\u2011form\u2011factor chip) and reach \u00b10.01\u00b0C setpoint stability within 1\u20133 seconds. This speed advantage is why\u00a0TEC devices<\/strong>\u00a0are the standard for laser diode temperature stabilization, where wavelength drift of 0.3\u202fnm\/\u00b0C must be eliminated in real time.<\/p>\n To evaluate a\u00a0thermoelectric module<\/strong>, engineers look at several key parameters. Below is a summary of typical ranges for a standard single\u2011stage TEC chip (e.g., 40\u202f\u00d7\u202f40\u202fmm footprint, 127 couples).<\/p>\n A high\u2011quality\u00a0Uk\u0142ad TEC<\/strong>\u00a0used in medical or aerospace applications may achieve \u0394Tmax > 75\u00b0C with dual\u2011stage or multistage modules (cascaded chips), reaching cold side temperatures of -80\u00b0C to -100\u00b0C.<\/p>\n At first glance, a\u00a0Peltier module<\/strong>\u00a0is less energy\u2011efficient than a large compressor system. Typical COP for a TEC at full cooling load ranges from\u00a00.4 to 0.7<\/strong>\u00a0(compared to 2\u20134 for a compressor). However, such simple comparisons miss the point: TEC technology excels where compressor cooling cannot be used at all (small form factor, no vibration, instant response) or at very low cooling power (under 20\u202fW). For point\u2011of\u2011need thermal management, the TEC chip offers an unbeatable power\u2011density\u2011per\u2011volume ratio.<\/p>\n Expert note<\/em>: When operating at 30\u202f% of Imax, a TEC chip\u2019s COP can rise to 1.0\u20131.5, making it surprisingly efficient for moderate temperature differentials (\u0394T < 20\u00b0C).<\/p>\n<\/blockquote>\n To understand where a\u00a0thermoelectric cooler<\/strong> is truly superior, compare it side\u2011by\u2011side with conventional refrigeration.<\/p>\n The takeaway: For applications under ~150\u202fW of cooling requirement, a\u00a0Uk\u0142ad TEC<\/strong>\u00a0is nearly always the superior choice \u2014 and sometimes the only feasible one.<\/p>\n The unique combination of fast response, precise setpoint control, and miniature footprint has made\u00a0thermoelectric modules<\/strong>\u00a0indispensable in dozens of industries. Below are some of the most impactful use cases.<\/p>\n Laser diodes used in fiber\u2011optic communication, medical surgery, and industrial cutting have strict wavelength stability requirements \u2014 sometimes within \u00b10.01\u202fnm. Because wavelength shifts about 0.3\u202fnm\/\u00b0C for many InGaAsP lasers, even a 0.1\u00b0C drift causes signal degradation. A\u00a0Uk\u0142ad TEC<\/strong>\u00a0placed directly under the laser submount, driven by a precision current controller, keeps the laser at a fixed temperature (often 25\u00b0C or 45\u00b0C) regardless of ambient fluctuations. Optical transceivers (SFP, QSFP) universally incorporate tiny\u00a0Peltier modules<\/strong>\u00a0to cool or heat the laser chip.<\/p>\n Polymerase Chain Reaction (PCR) amplifies DNA through 30\u201340 thermal cycles between 55\u00b0C and 95\u00b0C. A\u00a0thermoelectric cooler<\/strong> is the ideal actuator for the heating\u2011cooling block: it can heat (by reversing current or adding a resistive heater) and then rapidly cool (~3\u202f\u00b0C\/s) to anneal primers. Real\u2011time PCR systems demand temperature uniformity across 96 or 384 wells within \u00b10.1\u00b0C \u2014 a precision only achievable with well\u2011designed TEC chips and feedback control. Many modern medical diagnostic platforms also use TEC chips for reagent storage (maintaining 2\u20138\u00b0C inside a compact cartridge).<\/p>\n Electric vehicle (EV) battery packs generate significant heat, especially under fast charging. While large HVAC systems handle cabin and main pack cooling, some high\u2011end EVs use\u00a0thermoelectric modules<\/strong>\u00a0for spot cooling of battery management system (BMS) electronics, lidar sensors, or power inverters where fast, local temperature adjustments are required. Additionally, automotive seat climate systems (ventilated seats with active cooling) deploy TEC chips in the seat back and cushion \u2014 delivering instantaneous cooling from 12\u202fV vehicle power without compressor noise or weight.<\/p>\n Beam splitters and CCD\/CMOS sensors<\/strong>: Scientific cameras use TEC chips to cool the image sensor below ambient, drastically reducing dark current noise for long\u2011exposure astrophotography.<\/p>\n<\/li>\n Miniature refrigerators and wine coolers<\/strong>: Small 4\u2011 to 20\u2011bottle thermoelectric wine coolers rely entirely on\u00a0TEC modules<\/strong>\u00a0\u2014 quiet, vibration\u2011free, and able to maintain a constant 12\u201314\u00b0C.<\/p>\n<\/li>\n PCR cyclers for point\u2011of\u2011care<\/strong>: Handheld COVID\u201119 or flu diagnostic devices integrate a micro\u2011TEC chip for rapid heating\u2011cooling cycles without laboratory infrastructure.<\/p>\n<\/li>\n<\/ul>\n Outdoor telecom cabinets (5G base stations) are exposed to extreme heat in summer. A\u00a0thermoelectric cooler assembly<\/strong>\u00a0mounted on the cabinet door or side wall keeps internal temperature below 65\u00b0C, protecting sensitive RF and processing boards. Because TEC chips work equally well for heating, the same module can warm the enclosure in winter (avoiding condensation). There are no filters, compressors, or refrigerant lines to fail \u2014 a huge reliability boost for remote sites.<\/p>\n Choosing the correct\u00a0Peltier module<\/strong>\u00a0involves three steps:<\/p>\n Determine \u0394T<\/strong>: the difference between the desired cold side temperature and the ambient\/hot side temperature (e.g., cool laser to 22\u00b0C when ambient is 45\u00b0C \u2192 \u0394T = 23\u00b0C).<\/p>\n<\/li>\n Calculate heat load (Qc)<\/strong>: the total thermal power (in watts) that must be removed from the cold side: product self\u2011heating + external heat inflow + any active heat generation.<\/p>\n<\/li>\n Select a TEC chip<\/strong>\u00a0where Qmax (at the operating \u0394T and current) is at least 1.2\u202f\u00d7\u202fQc for safety margin.<\/p>\n<\/li>\n<\/ol>\n Most manufacturers provide performance curves (Qc vs. \u0394T at varying currents). A common mistake is underestimating the \u201chot side\u201d temperature: if the hot side exceeds 80\u00b0C, many uk\u0142adami TEC<\/strong>\u00a0degrade permanently.<\/p>\n A\u00a0Uk\u0142ad TEC<\/strong>\u00a0pumps heat from the cold to the hot side, but that waste heat must be efficiently rejected into the environment. Without an adequate heat sink + fan (or liquid cold plate), the hot side temperature rises, reducing \u0394Tmax and eventually causing thermal runaway. Rule of thumb: the heat sink should keep the hot side within <50\u00b0C for standard modules. For high\u2011power TEC applications (e.g., 100\u202fW), a forced\u2011air heat sink with thermal resistance <0.3\u202fK\/W is mandatory.<\/p>\n To achieve the famous \u00b10.01\u00b0C accuracy, a\u00a0Uk\u0142ad TEC<\/strong>\u00a0must be driven by a closed\u2011loop controller that reads a thermistor or RTK sensor embedded in or near the cold object. Pulse\u2011width modulation (PWM) plus a linear current driver minimizes thermal ripple. Many OEMs use dedicated TEC controller ICs (e.g., ADN8834, MAX1968) that combine H\u2011bridge output, proportional\u2011integral\u2011derivative (PID) compensation, and voltage\/current monitoring. Never connect a TEC chip directly to a battery or uncontrolled supply \u2014 large inrush current will damage the semiconductor pellets.<\/p>\n When operated within specified current, voltage, and temperature limits, a\u00a0thermoelectric module<\/strong>\u00a0has a mean time between failures (MTBF) exceeding\u00a0200,000 hours<\/strong>\u00a0(>20 years). The main wear mechanisms are:<\/p>\n Thermal cycling stress<\/strong>: repeated expansion\/contraction of solder joints inside the module can cause micro\u2011cracks after 100,000+ cycles. Advanced manufacturers use \u201chigh\u2011temperature solder\u201d (melting point >250\u00b0C) to improve cycle life.<\/p>\n<\/li>\n Moisture ingress<\/strong>: condensation inside the TEC chip corrodes bismuth telluride pellets. A hermetic edge seal (epoxy or silicone) is essential for humid environments.<\/p>\n<\/li>\n Overcurrent \/ ESD<\/strong>: applying more than Imax causes local melting of the semiconductor matrix, permanently reducing cooling capacity.<\/p>\n<\/li>\n Mechanical over\u2011torque<\/strong>: mounting the TEC chip with uneven pressure or excessive screw torque cracks the ceramic substrate.<\/p>\n<\/li>\n<\/ul>\n In telecom outdoor enclosures with proper sealing and active hot\u2011side cooling,\u00a0uk\u0142adami TEC<\/strong>\u00a0routinely operate for 15+ years with minimal degradation. PCR instrument manufacturers report mean cycles\u2011to\u2011failure > 500,000 thermal cycles, thanks to improved solder and ceramic interfaces. For most industrial applications, the TEC chip outlasts the product it cools.<\/p>\n Research into P\u2011type skutterudites and Mg\u2082Si\u2011based materials aims to increase the figure of merit (ZT) beyond the current 1.0\u20131.2 for Bi\u2082Te\u2083. A ZT > 1.5 would allow a\u00a0Uk\u0142ad TEC<\/strong>\u00a0to achieve the same \u0394T with 50% less power consumption, making solid\u2011state cooling viable for mainstream consumer appliances.<\/p>\n For chip\u2011scale photonics and wearable devices, ultra\u2011thin thermoelectric coolers (thickness <0.5\u202fmm) are fabricated using semiconductor deposition techniques. These micro\u2011TEC chips are integrated directly inside laser packages (butterfly packages) or even on\u2011chip for hot\u2011spot cooling of CPUs.<\/p>\n Some leading\u2011edge thermal management systems pair a\u00a0thermoelectric chip<\/strong>\u00a0with a miniature vapor chamber or heat pipe to reduce hot\u2011side thermal resistance even further, achieving effective cooling densities beyond 200\u202fW\/cm\u00b2 \u2014 ideal for high\u2011power laser diode arrays and graphics processors.<\/p>\n Q1: Can a TEC chip both heat and cool using the same polarity?<\/strong> Q2: How accurate is a typical TEC chip temperature control system?<\/strong> Q3: Do TEC chips waste a lot of electricity?<\/strong> Q4: What is the maximum cooling temperature difference from a single TEC chip?<\/strong> Q5: How do I choose between TEC and refrigeration for my product?<\/strong> From stabilising a medical laser\u2019s wavelength to running 40 rapid PCR cycles per hour, the\u00a0Uk\u0142ad TEC<\/strong>\u00a0has proven itself as the most agile, accurate, and reliable solid\u2011state thermal actuator available today. It eliminates the compromises of compressor\u2011based systems \u2014 bulky size, slow response, vibration, and refrigerant concerns \u2014 while delivering temperature control precision down to \u00b10.01\u00b0C. Whether you are designing next\u2011generation 5G optics, an EV battery spot\u2011cooling system, or a compact point\u2011of\u2011care diagnostic device, integrating a high\u2011performance\u00a0thermoelectric cooler module<\/strong>\u00a0will elevate your product\u2019s reliability and functionality.<\/p>\n We can help you select the right Peltier module<\/strong>\u00a0\u2014 from standard 40\u202f\u00d7\u202f40\u202fmm single\u2011stage chips to custom multi\u2011stage cascade arrays complete with thermal analysis and drive electronics recommendations.<\/p>","protected":false},"excerpt":{"rendered":" Uk\u0142ad TEC zapewnia reakcj\u0119 w zakresie milisekund, precyzj\u0119 \u00b10,01\u00b0C oraz bezawaryjno\u015b\u0107 w technologii p\u00f3\u0142przewodnikowej \u2014 idealne rozwi\u0105zanie do termoregulacji laser\u00f3w, urz\u0105dze\u0144 medycznych i akumulator\u00f3w samochod\u00f3w elektrycznych.<\/p>","protected":false},"author":1,"featured_media":673,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[36],"tags":[78,82,95,62,80],"class_list":["post-691","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-peltier-module","tag-precision-temperature-control","tag-solidstate-cooling","tag-tec-chip","tag-thermoelectric-cooler"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/posts\/691","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/comments?post=691"}],"version-history":[{"count":0,"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/posts\/691\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/media\/673"}],"wp:attachment":[{"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/media?parent=691"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/categories?post=691"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sgettec.com\/pl\/wp-json\/wp\/v2\/tags?post=691"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}Understanding the TEC Chip \u2014 How a Small Solid\u2011State Device Creates Instant Cooling<\/h2>\n
The Peltier Effect Explained in Simple Terms<\/h3>\n
Key Components Inside a TEC Chip<\/h3>\n
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How Fast Is \u201cFast\u201d? \u2014 Response Time and Settling<\/h3>\n
![\"TEC](\"https:\/\/www.sgettec.com\/wp-content\/uploads\/2026\/03\/file_1774487562972-300x234.png\" "\\"TEC")
The Performance Metrics That Define a Quality TEC Chip<\/h2>\n
\n\n
\n \nParametr<\/th>\n Typical Value<\/th>\n Significance<\/th>\n<\/tr>\n<\/thead>\n \n Maximum temperature difference (\u0394Tmax)<\/td>\n 65 \u2013 75\u00b0C (at hot side 27\u00b0C, vacuum)<\/td>\n Determines how cold the cold side can get relative to the ambient.<\/td>\n<\/tr>\n \n Maximum cooling power (Qmax)<\/td>\n 10 \u2013 150\u202fW (depending on size)<\/td>\n How much heat can be actively pumped from the cold side?<\/td>\n<\/tr>\n \n Maximum operating current (Imax)<\/td>\n 2 \u2013 15\u202fA<\/td>\n The current that achieves \u0394Tmax. Derate for lower current.<\/td>\n<\/tr>\n \n Maximum voltage (Vmax)<\/td>\n 5 \u2013 30\u202fV (DC)<\/td>\n Voltage at Imax.<\/td>\n<\/tr>\n \n Thermal resistance (ceramic to pellet)<\/td>\n 0.5 \u2013 2\u202fK\/W<\/td>\n Lower is better for heat transfer efficiency.<\/td>\n<\/tr>\n \n AC resistance (module ohms)<\/td>\n 0.5 \u2013 12\u202f\u03a9<\/td>\n Typical resistance at room temperature.<\/td>\n<\/tr>\n \n Wire gauge\/length<\/td>\n 20\u202fAWG, 200\u202fmm (common)<\/td>\n For safe current delivery.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n Coefficient of Performance (COP) \u2014 The Efficiency Reality<\/h3>\n
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TEC Chip vs. Traditional Compressor Cooling \u2014 A Feature Table<\/h2>\n
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\n \nFeature<\/th>\n TEC Chip (Solid\u2011State)<\/th>\n Compressor\u2011Based System<\/th>\n<\/tr>\n<\/thead>\n \n Temperature accuracy<\/strong><\/td>\n \u00b10.01\u00b0C or better (with PID)<\/td>\n \u00b11\u00b0C (typical)<\/td>\n<\/tr>\n \n Response time<\/strong><\/td>\n < 0.5 second to 90% setpoint<\/td>\n 5 \u2013 30 seconds<\/td>\n<\/tr>\n \n Size & weight<\/strong><\/td>\n Extremely compact (2 \u2013 30 mm thin)<\/td>\n Bulky (compressor, condenser, evaporator)<\/td>\n<\/tr>\n \n Moving parts<\/strong><\/td>\n None (zero vibration, silent)<\/td>\n Compressor fans, valves (audible noise, vibration)<\/td>\n<\/tr>\n \n Reliability (MTBF)<\/strong><\/td>\n > 100,000 hours (solid\u2011state)<\/td>\n ~10,000 \u2013 50,000 hours (moving parts wear)<\/td>\n<\/tr>\n \n Both heating + cooling<\/strong><\/td>\n Yes (reverse current)<\/td>\n No (heating requires a separate element)<\/td>\n<\/tr>\n \n Refrigerant<\/strong><\/td>\n None (environmentally benign)<\/td>\n HFCs \/ HCFCs (greenhouse concerns)<\/td>\n<\/tr>\n \n Applicability to micro\u2011devices<\/strong><\/td>\n Excellent (fits inside small enclosures)<\/td>\n Impractical<\/td>\n<\/tr>\n \n DC operation<\/strong><\/td>\n Native (12\u202fV, 24\u202fV, 48\u202fV)<\/td>\n Usually needs an AC inverter<\/td>\n<\/tr>\n \n Cost per watt of cooling<\/strong><\/td>\n Higher for large loads<\/td>\n Lower for large loads (>200\u202fW)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n Real\u2011World Applications: Where a TEC Chip Makes the Difference<\/h2>\n
Laser Diode and Optical Module Temperature Stabilization<\/h3>\n
PCR and Medical Diagnostic Instruments<\/h3>\n
Automotive \u2014 EV Battery Thermal Management and Seat Cooling<\/h3>\n
Consumer Electronics and Photonics<\/h3>\n
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Industrial and Telecom Enclosures<\/h3>\n
How to Integrate a TEC Chip Into Your Thermal Design \u2014 Practical Guidelines<\/h2>\n
Selection Criteria \u2014 Matching the TEC to Your Load<\/h3>\n
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Heat Sinking Is Non\u2011Negotiable<\/h3>\n
Drive Electronics \u2014 PID Controllers, Not Simple On\/Off<\/h3>\n
Reliability, Lifespan, and Common Failure Modes<\/h2>\n
Solid\u2011State Means Long Life \u2014 With Caveats<\/h3>\n
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Real\u2011World Field Data<\/h3>\n
Recent Innovations and Future Directions in TEC Chip Technology<\/h2>\n
Bismuth Telluride Alternatives<\/h3>\n
Thin\u2011Film and Micro\u2011TEC Chips<\/h3>\n
Integration with Two\u2011Phase Cooling<\/h3>\n
FAQ<\/h2>\n
\nNo. Heating requires reversing the DC polarity. Many TEC controllers include an H\u2011bridge for bi\u2011directional current.<\/p>\n
\nWith a precise PID controller and a calibrated thermistor, accuracy of \u00b10.01\u00b0C is standard \u2014 for demanding applications, \u00b10.001\u00b0C is possible.<\/p>\n
\nThey are less efficient than large compressors at high cooling loads (>100\u202fW). However, for small loads and fast response, the total energy consumption is often lower.<\/p>\n
\nFrom a hot side at 27\u00b0C, \u0394Tmax is usually 65\u00b0C \u2013 75\u00b0C. For colder temperatures (\u201180\u00b0C), multi\u2011stage cascaded TEC modules are used.<\/p>\n
\nUse TEC if you need silent operation, no vibration, compact size, fast temperature cycling, or cooling\/heating from one device. Use compressors only for large volume cooling >200\u202fW.<\/p>\nKonkluzja<\/h2>\n
Ready to Integrate a TEC Chip Into Your Design?<\/h3>\n