{"id":663,"date":"2026-02-28T13:16:47","date_gmt":"2026-02-28T05:16:47","guid":{"rendered":"https:\/\/www.sgettec.com\/?p=663"},"modified":"2026-02-28T13:17:08","modified_gmt":"2026-02-28T05:17:08","slug":"what-is-the-principle-of-the-tec-chip","status":"publish","type":"post","link":"https:\/\/www.sgettec.com\/ko\/what-is-the-principle-of-the-tec-chip\/","title":{"rendered":"TEC \uce69\uc758 \uc6d0\ub9ac\ub294 \ubb34\uc5c7\uc778\uac00\uc694?"},"content":{"rendered":"

Abstract:<\/strong><\/p>\n

The TEC Chip<\/a><\/span> (Thermoelectric Cooling Chip) functions through the Peltier effect, a thermoelectric phenomenon first identified in 1834 by Jean Charles Athanase Peltier, where heat is either absorbed or released at the junction of two different conductors when electric current passes through the circuit.<\/p>\n

Thermoelectric material studies published by the American Physical Society and semiconductor research compiled by the Institute of Electrical and Electronics Engineers indicate that TEC chips use semiconductor couples\u2014usually made of bismuth telluride-based materials\u2014to generate temperature differences without the need for moving parts, refrigerants, or mechanical compressors.<\/p>\n

This professional guide for 2026 examines the TEC Chip principle in detail, including thermodynamic theory, semiconductor material science, device architecture, electrical-thermal coupling equations, coefficient of performance (COP), efficiency constraints, integration design, industrial applications, failure mechanisms, and emerging innovations.<\/p>\n

Introduction: Why the TEC Chip Matters in Modern Thermal Engineering?<\/h2>\n

Thermal management has become essential in advanced electronics. From 5G infrastructure and medical lasers to semiconductor testing systems and battery packs, accurate temperature control influences system performance, reliability, and lifespan.<\/p>\n

Unlike conventional vapor-compression cooling systems, the TEC Chip provides solid-state cooling that is compact, vibration-free, and precisely adjustable. The importance of TEC technology in 2026 continues to increase because of:<\/p>\n

    \n
  • Miniaturization of electronics<\/li>\n
  • High-density semiconductor packaging<\/li>\n
  • Thermal stabilization of laser diodes<\/li>\n
  • Cooling for wearable medical devices<\/li>\n
  • Aerospace and defense electronics<\/li>\n<\/ul>\n

    Understanding the principle of the TEC Chip requires exploring both thermoelectric physics and semiconductor engineering.<\/p>\n

    \"TEC
    TEC \uce69<\/figcaption><\/figure>\n

    The Scientific Foundation: Thermoelectric Effects<\/h2>\n

    The TEC Chip functions through three interconnected thermoelectric phenomena.<\/p>\n

      \n
    1. The Seebeck Effect \u00a0<\/strong><\/li>\n<\/ol>\n

      The Seebeck effect explains how a voltage is produced when there is a temperature difference between two different materials.<\/p>\n

      This principle forms the basis of thermocouples and devices used for power generation.<\/p>\n

      In formula form:<\/p>\n

      V=S\u0394T<\/p>\n

      Where:<\/p>\n

        \n
      • V = voltage<\/li>\n
      • S = Seebeck coefficient<\/li>\n
      • \u0394T = temperature difference<\/li>\n<\/ul>\n

        Although the TEC Chip uses the reverse process, understanding Seebeck theory is fundamental.<\/p>\n

          \n
        1. The Peltier Effect (Core TEC Principle)<\/strong><\/li>\n<\/ol>\n

          When an electric current flows across two different semiconductor materials, heat is either absorbed or released at the junction. This is the central principle of a TEC Chip.<\/p>\n

          Heat transfer equation:<\/p>\n

          Q=\u03a0I<\/p>\n

          Where:<\/p>\n

            \n
          • Q = heat absorbed\/released<\/li>\n
          • \u03a0 = Peltier coefficient<\/li>\n
          • I = current<\/li>\n<\/ul>\n

            By controlling current direction, a TEC chip can function as either a cooler or a heater.<\/p>\n

              \n
            1. The Thomson Effect<\/strong><\/li>\n<\/ol>\n

              The Thomson effect involves heat absorption or release within a single conductor that has a temperature gradient and current flowing through it. Although it is less highlighted in fundamental explanations, it plays a role in the overall thermoelectric behavior of actual systems.<\/p>\n

              Structural Architecture of a TEC Chip<\/h2>\n

              A TEC Chip is made up of:<\/p>\n

                \n
              • Several P-type semiconductor components<\/li>\n
              • Several N-type semiconductor components<\/li>\n
              • Copper conductive interconnections<\/li>\n
              • Ceramic substrate plates (usually alumina)<\/li>\n<\/ul>\n

                The P-N pairs are connected in series electrically but in parallel thermally.<\/p>\n

                Simplified Structural Overview<\/h3>\n\n\n\n\n\n\n\n\n
                Component<\/b><\/strong><\/td>\nFunction<\/b><\/strong><\/td>\n<\/tr>\n
                P-type semiconductor<\/td>\nHole carrier transport<\/td>\n<\/tr>\n
                N-type semiconductor<\/td>\nElectron carrier transport<\/td>\n<\/tr>\n
                Ceramic plates<\/td>\nElectrical insulation + mechanical support<\/td>\n<\/tr>\n
                \uad6c\ub9ac \uc778\ud130\ucee4\ub125\ud2b8<\/td>\nElectrical pathway<\/td>\n<\/tr>\n
                Solder joints<\/td>\nMechanical + thermal bonding<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

                This modular architecture allows scaling by increasing the number of thermocouples.<\/p>\n

                Materials Science Behind TEC Chips<\/h2>\n

                Most commercial TEC chips use bismuth telluride (Bi\u2082Te\u2083)-based alloys because they exhibit high thermoelectric performance near room temperature.<\/p>\n

                  \n
                1. Key Material Parameters<\/strong><\/li>\n<\/ol>\n

                  The performance of thermoelectric materials is determined by the dimensionless figure of merit (ZT):<\/p>\n

                  ZT=\u03baS\u00b2\u03c3T\/k<\/p>\n

                  Where:<\/p>\n

                    \n
                  • S = Seebeck coefficient<\/li>\n
                  • \u03c3 = electrical conductivity<\/li>\n
                  • T = absolute temperature<\/li>\n
                  • \u03ba = thermal conductivity<\/li>\n<\/ul>\n

                    Higher ZT indicates better thermoelectric efficiency.<\/p>\n

                      \n
                    1. Material Comparison Table<\/strong><\/li>\n<\/ol>\n\n\n\n\n\n\n
                      Material<\/b><\/strong><\/td>\nOptimal Temperature Range<\/b><\/strong><\/td>\nTypical ZT<\/b><\/strong><\/td>\nApplication<\/b><\/strong><\/td>\n<\/tr>\n
                      Bi\u2082Te\u2083<\/td>\nNear room temp<\/td>\n0.8\u20131.2<\/td>\nTEC cooling modules<\/td>\n<\/tr>\n
                      PbTe<\/td>\nMedium-high temp<\/td>\n~1<\/td>\nIndustrial heat recovery<\/td>\n<\/tr>\n
                      SiGe<\/td>\nHigh temp<\/td>\n0.7\u20131<\/td>\nAerospace power systems<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

                      For TEC cooling near ambient conditions, bismuth telluride remains dominant in 2026.<\/p>\n

                      \"Tec
                      TEC \uce69<\/figcaption><\/figure>\n

                      How a TEC Chip Creates Cooling?<\/h2>\n
                        \n
                      1. The Peltier Effect \u00a0<\/strong><\/li>\n<\/ol>\n

                        A TEC chip functions based on the Peltier effect, which was discovered by Jean Charles Athanase Peltier in 1834.<\/p>\n

                        When direct current (DC) passes through a circuit made of two different semiconductor materials (n-type and p-type):<\/p>\n

                          \n
                        • Heat is absorbed at one junction (cold side).<\/li>\n
                        • Heat is released at the opposite junction (hot side).<\/li>\n<\/ul>\n

                          This results in a temperature difference across the module.<\/p>\n

                            \n
                          1. Internal Structure \u00a0<\/strong><\/li>\n<\/ol>\n

                            A typical TEC module includes:<\/p>\n

                              \n
                            • Multiple p-type and n-type semiconductor pairs<\/li>\n
                            • Connected electrically in series, thermally in parallel<\/li>\n
                            • Positioned between ceramic plates (typically alumina)<\/li>\n<\/ul>\n

                              When current passes through:<\/p>\n

                                \n
                              • Electrons transfer thermal energy from the cold side to the hot side<\/li>\n
                              • Heat needs to be removed from the hot side using a heat sink<\/li>\n<\/ul>\n

                                If the hot side is not cooled efficiently, the temperature of the cold side increases and the cooling efficiency decreases.<\/p>\n

                                  \n
                                1. Heat Pumping vs. Refrigeration<\/strong><\/li>\n<\/ol>\n
                                    \n
                                  • No refrigerant is used.<\/li>\n
                                  • No phase change occurs.<\/li>\n
                                  • Cooling is purely electron-driven.<\/li>\n<\/ul>\n

                                    TEC performance is defined by:<\/p>\n

                                      \n
                                    • Qmax (maximum heat pumping capacity).<\/li>\n
                                    • \u0394Tmax (maximum temperature difference).<\/li>\n
                                    • Input voltage and current.<\/li>\n<\/ul>\n
                                        \n
                                      1. Reversible Operation<\/strong><\/li>\n<\/ol>\n

                                        Reversing current direction:<\/p>\n

                                          \n
                                        • Swaps hot and cold sides.<\/li>\n
                                        • Enables heating as well as cooling.<\/li>\n<\/ul>\n

                                          This makes TEC chips ideal for temperature stabilization systems.<\/p>\n

                                          Electrical-Thermal Coupling<\/h2>\n

                                          TEC performance is governed by:<\/p>\n

                                          Qc = \u03b1ITc – 2I\u00b2R – K(Th – Tc)<\/p>\n

                                          Where:<\/p>\n

                                            \n
                                          • Qc = cooling capacity<\/li>\n
                                          • \u03b1 = Seebeck coefficient<\/li>\n
                                          • I = current<\/li>\n
                                          • R = electrical resistance<\/li>\n
                                          • K = thermal conductance<\/li>\n
                                          • Th = hot side temperature<\/li>\n
                                          • Tc = cold side temperature<\/li>\n<\/ul>\n

                                            This equation illustrates:<\/p>\n

                                              \n
                                            • Joule heating reduces efficiency<\/li>\n
                                            • Thermal backflow limits performance<\/li>\n<\/ul>\n

                                              Understanding this balance is critical for system optimization.<\/p>\n

                                              \uc131\ub2a5 \uacc4\uc218(COP)<\/h2>\n

                                              Unlike compressor-based systems, TEC chips typically have lower COP.<\/p>\n\n\n\n\n\n
                                              Cooling Method<\/b><\/strong><\/td>\nTypical COP<\/b><\/strong><\/td>\n<\/tr>\n
                                              Vapor Compression<\/td>\n2.5\u20134.0<\/td>\n<\/tr>\n
                                              TEC Chip<\/td>\n0.3\u20131.0<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

                                              However, TEC modules offer:<\/p>\n

                                                \n
                                              • Compactness<\/li>\n
                                              • Precise temperature control<\/li>\n
                                              • No moving parts<\/li>\n
                                              • Silent operation<\/li>\n<\/ul>\n

                                                Performance trade-offs define application suitability.<\/p>\n

                                                TEC \uce69\uc758 \uc7a5\uc810<\/h2>\n

                                                TEC devices provide distinct advantages over traditional cooling methods.<\/p>\n

                                                  \n
                                                1. Precise Temperature Control \u00a0<\/strong><\/li>\n<\/ol>\n
                                                    \n
                                                  • Achievable fine temperature regulation (\u00b10.01\u00b0C) through control circuitry<\/li>\n
                                                  • Suitable for laser diodes, sensors, CCD cameras, and medical devices<\/li>\n<\/ul>\n
                                                      \n
                                                    1. No Moving Parts \u00a0<\/strong><\/li>\n<\/ol>\n
                                                        \n
                                                      • Operate silently<\/li>\n
                                                      • Do not produce vibration<\/li>\n
                                                      • Experience minimal mechanical wear<\/li>\n<\/ul>\n

                                                        Ideal for optical and laboratory settings.<\/p>\n

                                                          \n
                                                        1. Compact and Lightweight \u00a0<\/strong><\/li>\n<\/ol>\n
                                                            \n
                                                          • Have a slim profile<\/li>\n
                                                          • Easily integrated into small devices<\/li>\n
                                                          • Enable localized spot cooling<\/li>\n<\/ul>\n

                                                            Essential for portable and miniaturized electronic systems.<\/p>\n

                                                              \n
                                                            1. Orientation Independent \u00a0<\/strong><\/li>\n<\/ol>\n

                                                              Unlike compressors:<\/p>\n

                                                                \n
                                                              • Are not limited by gravity<\/li>\n
                                                              • Can function in any position<\/li>\n<\/ul>\n

                                                                Advantageous in the aerospace and defense sectors.<\/p>\n

                                                                  \n
                                                                1. High Reliability (When Properly Managed)<\/strong><\/li>\n<\/ol>\n

                                                                  Because there are no mechanical components:<\/p>\n

                                                                    \n
                                                                  • Long operational life<\/li>\n
                                                                  • Low mechanical failure rates<\/li>\n<\/ul>\n

                                                                    However, thermal management design is critical.<\/p>\n

                                                                    Industrial Applications<\/h2>\n
                                                                      \n
                                                                    1. \ub808\uc774\uc800 \ub2e4\uc774\uc624\ub4dc \uc548\uc815\ud654<\/strong><\/li>\n<\/ol>\n

                                                                      TEC chips maintain precise wavelength control.<\/p>\n

                                                                        \n
                                                                      1. Semiconductor Testing<\/strong><\/li>\n<\/ol>\n

                                                                        Temperature cycling for chip validation.<\/p>\n

                                                                          \n
                                                                        1. Medical Equipment<\/strong><\/li>\n<\/ol>\n

                                                                          PCR machines and imaging devices.<\/p>\n

                                                                            \n
                                                                          1. Automotive Electronics<\/strong><\/li>\n<\/ol>\n

                                                                            Battery cooling and sensor temperature control.<\/p>\n

                                                                              \n
                                                                            1. Consumer Electronics<\/strong><\/li>\n<\/ol>\n

                                                                              Mini refrigerators and wearable cooling devices.<\/p>\n

                                                                              Integration Design Considerations<\/h2>\n

                                                                              TEC integration demands meticulous electrical and thermal engineering.<\/p>\n

                                                                                \n
                                                                              1. Thermal System Design \u00a0<\/strong><\/li>\n<\/ol>\n

                                                                                A frequent error is undervaluing heat rejection needs.<\/p>\n

                                                                                Total heat on the hot side equals the heat pumped (Qc) plus the electrical input power (I \u00d7 V).<\/p>\n

                                                                                This indicates:<\/p>\n

                                                                                  \n
                                                                                • The heat sink on the hot side must dissipate more heat than the device produces.<\/li>\n
                                                                                • Thermal resistance should be kept as low as possible.<\/li>\n<\/ul>\n

                                                                                  Best practices include:<\/p>\n

                                                                                    \n
                                                                                  • Utilizing high-performance heat sinks.<\/li>\n
                                                                                  • Applying high-quality thermal interface materials (TIM).<\/li>\n<\/ul>\n

                                                                                    &nbsp\u2022 Ensure consistent pressure across ceramic plates.<\/p>\n

                                                                                      \n
                                                                                    1. Power Supply and Control \u00a0<\/strong><\/li>\n<\/ol>\n

                                                                                      TEC modules need:<\/p>\n

                                                                                        \n
                                                                                      • Stable DC power.<\/li>\n
                                                                                      • Current-controlled operation is preferred over voltage control.<\/li>\n
                                                                                      • PID temperature controllers for accurate regulation.<\/li>\n<\/ul>\n

                                                                                        Overdriving the current decreases efficiency and reduces lifespan.<\/p>\n

                                                                                          \n
                                                                                        1. Condensation Management \u00a0<\/strong><\/li>\n<\/ol>\n

                                                                                          If cooling drops below the dew point:<\/p>\n

                                                                                            \n
                                                                                          • Moisture condensation will occur.<\/li>\n
                                                                                          • There is a risk of short circuits.<\/li>\n
                                                                                          • Electronics may corrode.<\/li>\n<\/ul>\n

                                                                                            Mitigation measures include:<\/p>\n

                                                                                              \n
                                                                                            • Insulation foam.<\/li>\n
                                                                                            • Conformal coatings.<\/li>\n
                                                                                            • Sealed enclosures.<\/li>\n<\/ul>\n
                                                                                                \n
                                                                                              1. Mechanical Stress Considerations \u00a0<\/strong><\/li>\n<\/ol>\n

                                                                                                TEC modules are fragile ceramic structures.<\/p>\n

                                                                                                Risks include:<\/p>\n

                                                                                                  \n
                                                                                                • Uneven clamping pressure.<\/li>\n
                                                                                                • Mismatch in thermal expansion.<\/li>\n<\/ul>\n

                                                                                                  &nbsp\u2022 Vibration stress<\/p>\n

                                                                                                  Recommended:<\/p>\n

                                                                                                    \n
                                                                                                  • Spring-loaded mounting systems<\/li>\n
                                                                                                  • Controlled torque assembly<\/li>\n<\/ul>\n
                                                                                                      \n
                                                                                                    1. Efficiency Optimization \u00a0<\/strong><\/li>\n<\/ol>\n

                                                                                                      TECs are less energy-efficient than compressor systems.<\/p>\n

                                                                                                      To optimize COP (Coefficient of Performance):<\/p>\n

                                                                                                        \n
                                                                                                      • Minimize \u0394T<\/li>\n
                                                                                                      • Avoid oversizing<\/li>\n
                                                                                                      • Use multi-stage TEC only when necessary<\/li>\n<\/ul>\n
                                                                                                        \"Tec
                                                                                                        TEC Chip<\/figcaption><\/figure>\n

                                                                                                        Reliability and Failure Modes<\/h2>\n

                                                                                                        While TECs are solid-state, they are not immune to failure.<\/p>\n

                                                                                                        Repeated thermal cycling leads to solder joint fatigue, semiconductor cracking, and an increase in internal resistance.<\/p>\n

                                                                                                        This is common in on\/off cycling applications.<\/p>\n

                                                                                                        Mitigation strategies include soft-start control, reducing temperature swings, and avoiding frequent power cycling.<\/p>\n

                                                                                                        If hot side cooling fails, the junction temperature can rise quickly, potentially causing permanent damage and melting internal solder.<\/p>\n

                                                                                                        Thermal runaway presents a significant risk.<\/p>\n

                                                                                                        It is advisable to use thermal monitoring sensors and overcurrent protection.<\/p>\n

                                                                                                        Electrical overstress occurs when rated voltage, current, or reverse polarity is exceeded.<\/p>\n

                                                                                                        Can lead to immediate device failure.<\/p>\n

                                                                                                        Always operate according to manufacturer specifications.<\/p>\n

                                                                                                        Moisture Ingress<\/p>\n

                                                                                                        In environments with high humidity:<\/p>\n

                                                                                                          \n
                                                                                                        • Internal connection corrosion<\/li>\n
                                                                                                        • Ceramic cracking due to freeze-thaw cycles<\/li>\n<\/ul>\n

                                                                                                          Hermetically sealed TEC modules are available for harsh conditions.<\/p>\n

                                                                                                          Mechanical Cracking<\/p>\n

                                                                                                          Excessive clamping pressure or impact:<\/p>\n

                                                                                                            \n
                                                                                                          • Cracks ceramic plates<\/li>\n
                                                                                                          • Results in internal open circuits<\/li>\n<\/ul>\n

                                                                                                            Mounting flatness and pressure uniformity are essential.<\/p>\n

                                                                                                            2026 Technological Innovations<\/h2>\n

                                                                                                            Emerging advancements include:<\/p>\n

                                                                                                              \n
                                                                                                            • Nanostructured thermoelectric materials<\/li>\n
                                                                                                            • Graphene-enhanced composites<\/li>\n
                                                                                                            • Micro-TEC arrays for semiconductor packaging<\/li>\n
                                                                                                            • AI-based thermal control systems<\/li>\n
                                                                                                            • Flexible TEC modules<\/li>\n<\/ul>\n

                                                                                                              Research aims to improve ZT beyond 2.0 for next-generation efficiency.<\/p>\n

                                                                                                              Comparison with Alternative Cooling Technologies<\/h2>\n\n\n\n\n\n\n\n\n
                                                                                                              Feature<\/b><\/strong><\/td>\nTEC Chip<\/b><\/strong><\/td>\nCompressor Cooling<\/b><\/strong><\/td>\nLiquid Cooling<\/b><\/strong><\/td>\n<\/tr>\n
                                                                                                              Moving Parts<\/td>\nNo<\/td>\nYes<\/td>\nYes<\/td>\n<\/tr>\n
                                                                                                              Noise<\/td>\nSilent<\/td>\nAudible<\/td>\nVariable<\/td>\n<\/tr>\n
                                                                                                              Maintenance<\/td>\nLow<\/td>\nMedium<\/td>\nHigh<\/td>\n<\/tr>\n
                                                                                                              Precision<\/td>\nHigh<\/td>\nModerate<\/td>\nHigh<\/td>\n<\/tr>\n
                                                                                                              Efficiency<\/td>\nLower<\/td>\nHigher<\/td>\nHigh<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

                                                                                                              The TEC chip fills a precision niche rather than replacing traditional cooling.<\/p>\n

                                                                                                              FAQ Section<\/h2>\n

                                                                                                              Q1: What is the main principle behind a TEC Chip?<\/p>\n

                                                                                                              It operates based on the Peltier effect, where electrical current induces heat transfer at semiconductor junctions.<\/p>\n

                                                                                                              Q2: Can a TEC Chip both heat and cool?<\/p>\n

                                                                                                              Yes. Reversing the current direction switches between heating and cooling modes.<\/p>\n

                                                                                                              Q3: Why is TEC efficiency lower than that of compressor systems?<\/p>\n

                                                                                                              Because thermoelectric cooling suffers from Joule heating and thermal backflow losses.<\/p>\n

                                                                                                              Q4: What materials are used in TEC chips?<\/p>\n

                                                                                                              Primarily, bismuth telluride-based semiconductor alloys.<\/p>\n

                                                                                                              Q5: What is the maximum temperature difference a TEC can achieve?<\/p>\n

                                                                                                              Typically 60\u201370\u00b0C under optimal conditions.<\/p>\n

                                                                                                              \uacb0\ub860<\/h2>\n

                                                                                                              The TEC Chip operates based on the Peltier effect, utilizing semiconductor physics to generate temperature differences by passing electrical current. Although it is less energy-efficient than conventional refrigeration, TEC chips provide exceptional accuracy, small size, and dependability for specific uses.<\/p>\n

                                                                                                              In 2026, TEC technology will keep advancing through breakthroughs in material science and the integration of intelligent systems. Instead of directly competing with vapor compression systems, TEC chips serve a vital role in precise thermal management for electronics, medical devices, aerospace systems, and advanced industrial equipment. Gaining an understanding of the scientific principles, material limitations, electrical-thermal coupling equations, and integration needs enables engineers and procurement professionals to implement TEC technology efficiently\u2014enhancing performance while reducing inefficiencies.<\/p>","protected":false},"excerpt":{"rendered":"

                                                                                                              TEC \uce69\uc758 \uc791\ub3d9 \uc6d0\ub9ac\ub294 \ubb34\uc5c7\uc778\uac00\uc694? TEC \uce69\uc740 \uc5b4\ub5a4 \uc6a9\ub3c4\ub85c \uc0ac\uc6a9\ub418\ub098\uc694? TEC \uce69\uc744 \ud6a8\uacfc\uc801\uc73c\ub85c \uc0ac\uc6a9\ud558\ub824\uba74 \uc774\ub97c \uc798 \uc774\ud574\ud574\uc57c \ud569\ub2c8\ub2e4. \uc774 \uac00\uc774\ub4dc\uc5d0\uc11c\ub294 \uc790\uc138\ud55c \uc0ac\uc6a9\ubc95\uc744 \uc548\ub0b4\ud574 \ub4dc\ub9ac\ub2c8 \ud568\uaed8 \uc0b4\ud3b4\ubcf4\uc2dc\uc8e0.<\/p>","protected":false},"author":1,"featured_media":525,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[36],"tags":[65,62,63,66],"class_list":["post-663","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-clean-tec-chip","tag-tec-chip","tag-tec-chip-manufacturer","tag-tec-chip-supplier"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/posts\/663","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/comments?post=663"}],"version-history":[{"count":0,"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/posts\/663\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/media\/525"}],"wp:attachment":[{"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/media?parent=663"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/categories?post=663"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sgettec.com\/ko\/wp-json\/wp\/v2\/tags?post=663"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}