{"id":665,"date":"2026-03-05T10:55:39","date_gmt":"2026-03-05T02:55:39","guid":{"rendered":"https:\/\/www.sgettec.com\/?p=665"},"modified":"2026-03-05T10:55:39","modified_gmt":"2026-03-05T02:55:39","slug":"high-performance-tec-chip-for-precision-temperature-control","status":"publish","type":"post","link":"https:\/\/www.sgettec.com\/de\/high-performance-tec-chip-for-precision-temperature-control\/","title":{"rendered":"Hochleistungs-TEC-Chip f\u00fcr pr\u00e4zise Temperaturregelung"},"content":{"rendered":"<p class=\"article-h1\"><strong><span style=\"font-size: 16px;\">Zusammenfassung<\/span><\/strong><\/p>\n<p>Thermoelectric cooling (TEC) chips are a vital technology that enables precise temperature control in contemporary electronics, medical diagnostics, and industrial instrumentation. Unlike traditional mechanical refrigeration systems, TEC modules utilize solid-state physics to provide localized cooling without the need for moving parts, refrigerants, or generating noise.<\/p>\n<p>This guide explores the fundamental principles behind Peltier effect devices, measures key performance metrics necessary for engineering requirements, and describes the compliance standards that regulate international procurement.<\/p>\n<p>B2B buyers will obtain practical insights into how to calculate thermal capacity, choose materials, and qualify suppliers essential for incorporating TEC technology into mission-critical applications that demand \u00b10.01\u00b0C temperature stability.<\/p>\n<hr \/>\n<h2 class=\"article-h2\">What is a TEC Chip and How Does It Work<\/h2>\n<h3 class=\"article-h3\">Thermoelectric Cooling Fundamentals<\/h3>\n<p>The <span style=\"color: #ff0000;\"><a style=\"color: #ff0000;\" href=\"https:\/\/www.sgettec.com\/de\/products\/tec-chip\/\">TEC-Chip<\/a><\/span> functions based on the Peltier effect\u2014a thermoelectric phenomenon in which an electrical current flowing through different semiconductor junctions produces a temperature difference. When a DC voltage is applied, charge carriers (electrons in n-type material and holes in p-type material) take in thermal energy at the cold junction and release it at the hot junction. This process of directional heat transfer allows for active cooling below ambient temperature without the need for mechanical compression cycles.<\/p>\n<p>Key operational characteristics include:<\/p>\n<ul>\n<li>Reversible heat transfer: Polarity reversal switches between cooling and heating modes.<\/li>\n<li>Proportional control: Cooling power increases linearly with input current up to Imax.<\/li>\n<li>Cascade capability: Multi-stage setups can achieve \u0394T exceeding 70\u00b0C.<\/li>\n<\/ul>\n<p>The efficiency of this process depends on the Seebeck coefficient, electrical resistivity, and thermal conductivity of the semiconductor materials\u2014collectively called the thermoelectric figure of merit (ZT). Modern TEC chips reach ZT values between 0.8 and 1.0 at room temperature, resulting in coefficient of performance (COP) ratios of 0.3 to 0.6 under typical operating conditions.<\/p>\n<h3 class=\"article-p\">Key Components and Material Science<\/h3>\n<p>Commercial TEC modules use bismuth telluride (Bi\u2082Te\u2083) alloy semiconductors designed for temperature ranges between 200 and 400K. The material structure includes:<\/p>\n<p><strong>Thermoelectric Elements<\/strong><\/p>\n<ul>\n<li>N-type Bi\u2082Te\u2083 doped with selenium or iodine, which acts as electron carrier.<\/li>\n<li>P-type Bi\u2082Te\u2083 doped with antimony or bismuth, functioning as hole carriers.<\/li>\n<li>Typical element dimensions are a cross-section of 1.0-1.5mm and a height of 1.5-2.0mm.<\/li>\n<\/ul>\n<p><strong>Substrate Construction<\/strong><\/p>\n<ul>\n<li>Alumina (Al\u2082O\u2083) ceramic plates with a thickness of 0.6-1.0mm and a thermal conductivity of 24-28 W\/m\u00b7K.<\/li>\n<li>Alternative aluminum nitride (AlN) substrates are suitable for high-power applications (170-200 W\/m\u00b7K).<\/li>\n<li>Surface flatness tolerance is less than 25\u03bcm for optimal thermal interface contact.<\/li>\n<li>Electrical Interconnects include copper metallization layers with a thickness of 50-100\u03bcm.<\/li>\n<li>The solder alloy composition can be Sn-Pb or lead-free SAC305 (Sn-Ag-Cu).<\/li>\n<\/ul>\n<p>Contact resistance should be optimized to be less than 5m\u03a9 per junction to minimize parasitic heat generation.<\/p>\n<p>Material purity standards require 99.99% semiconductor grade bismuth telluride to prevent crystallographic defects that reduce carrier mobility.<\/p>\n<p>The ceramic substrate must withstand thermal cycling between -40\u00b0C and +120\u00b0C without delamination, requiring matched thermal expansion coefficients (CTE) between layers within 2 ppm\/K.<\/p>\n<figure id=\"attachment_594\" aria-describedby=\"caption-attachment-594\" style=\"width: 600px\" class=\"wp-caption aligncenter\"><img fetchpriority=\"high\" decoding=\"async\" class=\"wp-image-594\" title=\"TEC chip\" src=\"https:\/\/www.sgettec.com\/wp-content\/uploads\/2025\/12\/img_v3_02st_4ad7435d-b1da-4314-a494-16b89bf587ag.webp\" alt=\"TEC chip\" width=\"600\" height=\"479\" data-no-translation=\"\" \/><figcaption id=\"caption-attachment-594\" class=\"wp-caption-text\">TEC-Chip<\/figcaption><\/figure>\n<hr \/>\n<h2 class=\"article-h2\">Critical Performance Specifications for TEC Chip Selection<\/h2>\n<h3 class=\"article-h3\">Thermal Performance Parameters<\/h3>\n<p class=\"article-p\">TEC chip datasheets specify three interdependent thermal characteristics:<\/p>\n<table style=\"border-collapse: collapse; width: 100%; border: 1px solid #000;\">\n<thead>\n<tr>\n<th style=\"border: 1px solid #000; padding: 8px; background-color: #eee;\"><strong>Parameter<\/strong><\/th>\n<th style=\"border: 1px solid #000; padding: 8px; background-color: #eee;\"><strong>Definition<\/strong><\/th>\n<th style=\"border: 1px solid #000; padding: 8px; background-color: #eee;\"><strong>Typical Range<\/strong><\/th>\n<th style=\"border: 1px solid #000; padding: 8px; background-color: #eee;\"><strong>Measurement Conditions<\/strong><\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td style=\"border: 1px solid #000; padding: 8px;\"><strong>Qmax<\/strong><\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">Maximum cooling capacity<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">5-200W<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">\u0394T=0\u00b0C, Th=27\u00b0C, Imax<\/td>\n<\/tr>\n<tr>\n<td style=\"border: 1px solid #000; padding: 8px;\"><strong>\u0394Tmax<\/strong><\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">Maximum temperature differential<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">60-75\u00b0C<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">Qc=0W, Th=27\u00b0C, Imax<\/td>\n<\/tr>\n<tr>\n<td style=\"border: 1px solid #000; padding: 8px;\"><strong>Imax<\/strong><\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">Maximum input current<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">3-15A<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">Voltage at peak performance<\/td>\n<\/tr>\n<tr>\n<td style=\"border: 1px solid #000; padding: 8px;\"><strong>Vmax<\/strong><\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">Maximum input voltage<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">12-16V<\/td>\n<td style=\"border: 1px solid #000; padding: 8px;\">Corresponding to IMAX<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p class=\"article-p\"><strong>Leistungszahl (COP)<\/strong> quantifies energy efficiency:<\/p>\n<p class=\"article-p\">COP = Qc \/ (V \u00d7 I)<\/p>\n<p class=\"article-p\">Where Qc represents useful cooling power. At \u0394T=0\u00b0C, high-performance modules achieve COP values of 0.5-0.6. This ratio degrades exponentially as temperature differential increases\u2014at \u0394T=40\u00b0C, typical COP drops to 0.2-0.3. For applications requiring sustained cooling below ambient, heat sink thermal resistance (Rth) becomes the dominant design constraint:<\/p>\n<p class=\"article-p\">Rth = (Th &#8211; Ta) \/ (Qc + P)<\/p>\n<p class=\"article-p\">Where Ta is the ambient temperature, and P is the electrical input power. Precision applications demand Rth &lt;0.3\u00b0C\/W to maintain cold-side stability.<\/p>\n<h3 class=\"article-h3\">Electrical and Dimensional Standards<\/h3>\n<p class=\"article-p\"><strong>Input Power Requirements<\/strong><\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Operating voltage: 80-90% of Vmax for reliability (typical 10-14VDC)<\/li>\n<li class=\"article-li\">Current ripple tolerance: &lt;5% to prevent thermal cycling fatigue<\/li>\n<li class=\"article-li\">PWM control frequency: 100Hz-10kHz for proportional cooling modulation<\/li>\n<\/ul>\n<p class=\"article-p\"><strong>Form Factor Classifications<\/strong><br \/>\nStandard module dimensions follow industry conventions:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Miniature: 15\u00d715mm to 30\u00d730mm (Qmax 5-25W)<\/li>\n<li class=\"article-li\">Standard: 40\u00d740mm to 50\u00d750mm (Qmax 50-100W)<\/li>\n<li class=\"article-li\">High-capacity: 62\u00d762mm (Qmax 150-200W)<\/li>\n<\/ul>\n<p class=\"article-p\">Thickness ranges from 3.0mm for single-stage modules to 8.0mm for two-stage cascade designs. Mounting hole patterns conform to 2.5mm or M3 fastener specifications with positional tolerance \u00b10.2mm.<\/p>\n<hr \/>\n<h2 class=\"article-h2\">Industrial Applications and Integration Requirements<\/h2>\n<h3 class=\"article-h3\">Thermisches Management in der Elektronik<\/h3>\n<p class=\"article-p\"><strong>Stabilisierung von Laserdioden<\/strong><br \/>\nWavelength drift in semiconductor lasers correlates directly with junction temperature at rates of 0.2-0.3nm\/\u00b0C. TEC chips maintain \u00b10.01\u00b0C stability for:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Telecommunications: DWDM optical transceivers (1550nm)<\/li>\n<li class=\"article-li\">Medical: Surgical laser systems requiring FDA Class IIIb compliance<\/li>\n<li class=\"article-li\">Industrial: Fiber laser cutting systems (1064nm)<\/li>\n<\/ul>\n<p class=\"article-p\">Integration requires thermistor feedback control with 10k\u03a9 NTC sensors and PID loop response times &lt;1 second.<\/p>\n<p class=\"article-p\"><strong>CPU\/GPU Cooling<\/strong><br \/>\nHigh-performance computing applications leverage TEC modules for:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Overclocking workstations: Sub-ambient cold plate temperatures (-5\u00b0C to +10\u00b0C)<\/li>\n<li class=\"article-li\">Server rack hotspot mitigation: Localized cooling for FPGA\/ASIC clusters<\/li>\n<li class=\"article-li\">Thermal testing chambers: Accelerated stress validation at temperature extremes<\/li>\n<\/ul>\n<p class=\"article-p\">Power density constraints limit practical deployment to &lt;150W heat loads without liquid-assisted heat rejection.<\/p>\n<p class=\"article-p\"><strong>Optical Sensor Temperature Regulation<\/strong><br \/>\nInfrared detectors, CCD cameras, and spectrometers require temperature stabilization to minimize dark current noise:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Scientific imaging: TE-cooled CCD sensors at -20\u00b0C to -40\u00b0C<\/li>\n<li class=\"article-li\">Gas analyzers: NDIR sensors with \u00b10.1\u00b0C reference cell control<\/li>\n<li class=\"article-li\">LiDAR systems: APD detector arrays with &lt;0.05\u00b0C thermal drift<\/li>\n<\/ul>\n<h3 class=\"article-h3\">Medizinische und Laborger\u00e4te<\/h3>\n<p class=\"article-p\"><strong>PCR-Thermocycler<\/strong><br \/>\nDNA amplification protocols demand rapid thermal transitions (5-10\u00b0C\/sec ramp rates) with \u00b10.5\u00b0C well-to-well uniformity. Multi-zone TEC arrays enable:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">96-well block heating: 4\u00b0C to 99\u00b0C cycling<\/li>\n<li class=\"article-li\">Gradient functionality: Simultaneous temperature zones for primer optimization<\/li>\n<li class=\"article-li\">Cold storage: 4\u00b0C sample preservation between runs<\/li>\n<\/ul>\n<p class=\"article-p\">IVD compliance requires validation per ISO 13485 quality management standards.<\/p>\n<p class=\"article-p\"><strong>Diagnostic Imaging Systems<\/strong><br \/>\nMRI gradient coil cooling and X-ray tube thermal management utilize high-capacity TEC modules (&gt;100W) with:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Medical device certification: IEC 60601-1 electrical safety<\/li>\n<li class=\"article-li\">EMI shielding: &lt;40dB radiated emissions per CISPR 11 Group 1<\/li>\n<li class=\"article-li\">Cleanroom compatibility: Particle generation &lt;100 counts\/ft\u00b3 at 0.5\u03bcm<\/li>\n<\/ul>\n<h3 class=\"article-h3\">Compliance and Certification Landscape<\/h3>\n<p class=\"article-p\"><strong>Material Restrictions<\/strong><\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">RoHS Directive 2011\/65\/EU: Lead-free solder alternatives (SAC305) reduce performance by 8-12% versus Sn-Pb<\/li>\n<li class=\"article-li\">REACH SVHC compliance: Bismuth telluride exemptions under Annex III for thermoelectric applications<\/li>\n<li class=\"article-li\">Conflict minerals reporting: Tantalum-free capacitor specifications for Dodd-Frank compliance<\/li>\n<\/ul>\n<p class=\"article-p\"><strong>Manufacturing Standards<\/strong><\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">ISO 9001:2015: Quality management system certification for supplier audits<\/li>\n<li class=\"article-li\">IATF 16949: Automotive-grade TEC modules for EV battery thermal management<\/li>\n<li class=\"article-li\">AS9100D: Aerospace applications requiring lot traceability and PPAP documentation<\/li>\n<\/ul>\n<p class=\"article-p\"><strong>Safety Approvals<\/strong><br \/>\nUL 1995 (Heating and Cooling Equipment) and CE marking under Low Voltage Directive 2014\/35\/EU mandate:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Insulation resistance: &gt;50M\u03a9 at 500VDC<\/li>\n<li class=\"article-li\">Dielectric strength: 1500VAC for 1 minute without breakdown<\/li>\n<li class=\"article-li\">Flammability rating: V-0 per UL 94 for encapsulation materials<\/li>\n<\/ul>\n<figure id=\"attachment_527\" aria-describedby=\"caption-attachment-527\" style=\"width: 600px\" class=\"wp-caption aligncenter\"><img decoding=\"async\" class=\"wp-image-527\" title=\"TEC Chip\" src=\"https:\/\/www.sgettec.com\/wp-content\/uploads\/2025\/12\/\u5fae\u4fe1\u56fe\u7247_20251205170852.png\" alt=\"Tec Chip\" width=\"600\" height=\"372\" data-no-translation=\"\" \/><figcaption id=\"caption-attachment-527\" class=\"wp-caption-text\">TEC Chip<\/figcaption><\/figure>\n<hr \/>\n<h2 class=\"article-h2\">Procurement Guidelines for B2B Buyers<\/h2>\n<h3 class=\"article-h3\">Supplier Evaluation Criteria<\/h3>\n<p class=\"article-p\"><strong>Manufacturing Capability Assessment<\/strong><br \/>\nQualified TEC chip suppliers demonstrate:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Automated die bonding equipment with \u00b110\u03bcm placement accuracy<\/li>\n<li class=\"article-li\">X-ray inspection systems for solder void detection (&lt;2% void area)<\/li>\n<li class=\"article-li\">100% electrical testing at Qmax and \u0394Tmax conditions<\/li>\n<li class=\"article-li\">Statistical process control (Cpk &gt;1.33) for critical dimensions<\/li>\n<\/ul>\n<p class=\"article-p\">Request supplier documentation, including:<\/p>\n<ol class=\"article-ol\">\n<li class=\"article-li\">Process FMEA for solder joint reliability<\/li>\n<li class=\"article-li\">Accelerated life test data (85\u00b0C\/85%RH for 1000 hours)<\/li>\n<li class=\"article-li\">Thermal cycling qualification (-40\u00b0C to +120\u00b0C, 500 cycles minimum)<\/li>\n<\/ol>\n<p class=\"article-p\"><strong>Quality Control Protocols<\/strong><br \/>\nIncoming inspection procedures should verify:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Visual defects: Chip\/crack-free ceramic surfaces<\/li>\n<li class=\"article-li\">Performance validation: Qmax within \u00b110% of datasheet specification<\/li>\n<li class=\"article-li\">Thermal resistance: Rth measurement using transient thermal impedance testing<\/li>\n<\/ul>\n<p class=\"article-p\">Establish acceptable quality level (AQL) standards at 0.65% for critical defects (electrical failure) and 2.5% for major defects (cosmetic flaws).<\/p>\n<h3 class=\"article-h3\">Total Cost of Ownership Analysis<\/h3>\n<p class=\"article-p\"><strong>Unit Pricing vs. System Efficiency<\/strong><br \/>\nWhile low-cost TEC modules ($15-30 per unit) offer attractive initial pricing, total system costs must account for:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Power supply requirements: 12VDC @ 10A regulated supplies add $40-80<\/li>\n<li class=\"article-li\">Heat sink assembly: Forced-air cooling adds $25-60; liquid cold plates add $150-300<\/li>\n<li class=\"article-li\">Control electronics: PID temperature controllers with thermistor inputs cost $50-120<\/li>\n<\/ul>\n<p class=\"article-p\">Premium TEC modules ($60-150) with higher COP values reduce operational costs:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">20% efficiency improvement = 15-20W power savings<\/li>\n<li class=\"article-li\">Annual energy cost reduction: $12-18 per module at $0.10\/kWh industrial rates<\/li>\n<li class=\"article-li\">Payback period: 18-24 months for continuous-duty applications<\/li>\n<\/ul>\n<p class=\"article-p\"><strong>Expected Operational Lifespan<\/strong><br \/>\nMean time between failures (MTBF) for industrial-grade TEC chips:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">Standard duty (8hrs\/day): &gt;200,000 hours<\/li>\n<li class=\"article-li\">Continuous operation (24\/7): 80,000-100,000 hours<\/li>\n<li class=\"article-li\">High-stress environments (\u0394T &gt;50\u00b0C): 40,000-60,000 hours<\/li>\n<\/ul>\n<p class=\"article-p\">Warranty terms should guarantee minimum performance retention:<\/p>\n<ul class=\"article-ul\">\n<li class=\"article-li\">90% of initial Qmax after 5 years for medical\/aerospace applications<\/li>\n<li class=\"article-li\">85% retention is acceptable for commercial electronics applications<\/li>\n<\/ul>\n<hr \/>\n<h2 class=\"article-h2\">Frequently Asked Questions<\/h2>\n<p class=\"article-p\"><strong>Q1: What is the typical lifespan of a TEC chip under continuous operation?<\/strong><br \/>\nIndustrial-grade TEC modules demonstrate 80,000-100,000 hour MTBF under continuous 24\/7 operation at nominal conditions (\u0394T &lt;40\u00b0C, Th &lt;60\u00b0C).<\/p>\n<p class=\"article-p\">Lifespan degrades when operated above 90% of Imax due to electromigration in copper interconnects. Derating to 80% of maximum current extends operational life to &gt;150,000 hours.<\/p>\n<p class=\"article-p\">Thermal cycling accelerates fatigue\u2014applications with frequent on\/off cycles should specify modules with reinforced solder joints and ceramic substrates rated for &gt;1000 thermal shocks.<\/p>\n<p class=\"article-p\"><strong>Q2: How do I calculate the required cooling capacity for my specific application?<\/strong><br \/>\nTotal heat load (Qtotal) equals device dissipation plus TEC input power: Qtotal = Qdevice + (V \u00d7 I). For a 25W laser diode requiring 15\u00b0C below ambient (Ta=25\u00b0C, target Tc=10\u00b0C): Select TEC with Qmax \u226535W at \u0394T=15\u00b0C.<\/p>\n<p class=\"article-p\">Consult the manufacturer&#8217;s performance curves showing Qc vs. \u0394T at various input currents. Add 20-30% safety margin for thermal interface resistance and ambient temperature variations. The heat sink must dissipate Qtotal with Rth sufficient to maintain hot-side temperature Th &lt;80\u00b0C.<\/p>\n<p class=\"article-p\"><strong>Q3: Can TEC modules operate in high-humidity or corrosive environments?<\/strong><br \/>\nStandard TEC chips lack hermetic sealing\u2014moisture ingress causes electrical leakage and corrosion. For humidity &gt;70%RH or corrosive atmospheres, specify:<\/p>\n<p class=\"article-p\">(1) Conformal coating with acrylic or silicone encapsulation,<\/p>\n<p class=\"article-p\">(2) Hermetically sealed modules with welded metal housings (adds 30-50% cost premium),<\/p>\n<p class=\"article-p\">(3) Desiccant-purged enclosures maintaining &lt;40%RH. Salt spray testing per ASTM B117 validates marine\/coastal installations. Condensation risk exists when cold-side temperature drops below the dew point\u2014implement active humidity control or insulation barriers.<\/p>\n<hr \/>\n<h2 class=\"article-h2\">Conclusion<\/h2>\n<p>Successful TEC chip integration requires careful focus on thermal system design, electrical interface standards, and supplier quality assurance. B2B procurement teams should focus on manufacturers that have ISO 9001 certification, thorough performance testing procedures, and clear material compliance records.<\/p>\n<p>Testing samples under real operating conditions, rather than relying solely on datasheet specs, helps avoid expensive field failures. Build long-term relationships with suppliers that offer engineering support for thermal modeling, custom module creation, and obsolescence management.<\/p>\n<p>As precision temperature control becomes more essential in next-generation electronics and medical devices, investing strategically in proven TEC technology provides competitive benefits through improved product reliability, lower warranty expenses, and faster time-to-market for temperature-sensitive applications<\/p>","protected":false},"excerpt":{"rendered":"<p>Dieser Leitfaden bietet einen umfassenden \u00dcberblick \u00fcber leistungsstarke TEC-Chips, die zur pr\u00e4zisen Temperatursteuerung eingesetzt werden, und unterst\u00fctzt Sie dabei, TEC-Chips effektiv zu verstehen und zu nutzen.<\/p>","protected":false},"author":1,"featured_media":664,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[36],"tags":[62,66,69],"class_list":["post-665","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-tec-chip","tag-tec-chip-supplier","tag-tec-module-for-electronics"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/posts\/665","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/comments?post=665"}],"version-history":[{"count":0,"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/posts\/665\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/media\/664"}],"wp:attachment":[{"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/media?parent=665"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/categories?post=665"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sgettec.com\/de\/wp-json\/wp\/v2\/tags?post=665"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}